Award for Best Overall PIC Paper to Watkins

David Watkins
David Watkins

At the ASEE (American Society for Engineering Education) annual conference in Columbus, Ohio, June 25-28, 2017, the award for the Best Overall PIC (Professional Interest Councils) Paper, “Going is Not Knowing: Challenges in Creating Intercultural Engineers,” was presented to Michigan Tech’s David Watkins (CEE) and co-authors Kurt Paterson, James Madison University, and Chris Swan, Tufts University.

A lot of the data for the study came from surveys of students in our D80 Center programs, such as Peace Corps Master’s International, Engineers Without Borders, iDesign and other. The somewhat surprising results included recommendations for how we can provide students with more meaningful intercultural learning experiences. David Watkins

Engineers Without Borders
Michigan Tech Engineers Without Borders students help bring clean water to communities in Guatemala.

Going is Not Knowing: Challenges in Creating Intercultural Engineers

ABSTRACT

The last twenty years has witnessed a surge in the growth of community engagement programs for engineering students in the United States. Coupled to the enthusiasm of the Millennial Generation, many of these efforts have an international community development focus where engineering teams work with community members on small-scale infrastructure. One expressed motivation for such programs is the transformative experience and mindset-shift many participants report upon return from their time abroad. Industry has been quick to endorse such opportunities as necessary in creating the “global engineer”, a professional adept and effective in a dynamic interconnected work world. This paper explores these perceptions through an objective measure of intercultural awareness, the Intercultural Development Inventory (IDI).

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2017 ASEE Conference

124th ASEE Annual Conference & Exposition

Where Engineering Education Takes Flight – From P-12 Through Life

June 25 – 28, 2017, Columbus, Ohio

The only conference dedicated to all disciplines of engineering education…

We are committed to fostering the exchange of ideas, enhancing teaching methods and curriculum, and providing prime networking opportunities for engineering and technology education stakeholders such as: deans, faculty members, and industry and government representatives.

The conference features more than 400 technical sessions, with peer-reviewed papers spanning all disciplines of engineering education.

The Best Overall PIC Paper was recognized at the Tuesday Plenary session on June 27 at the Columbus Convention Center.


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