Day: April 1, 2026

PREP0004384 Research Associate: Modeling and Mechanical Testing for Heterogenous Structures of Advanced Semiconductor Packaging (CHIPS Funded)

NIST EL – 73 has a new PREP research opportunity described below and in the attached (PREP0004384). The NIST Sponsor is seeking candidate recommendations.

  • Project Title/Description: PREP0004384: Modeling and Mechanical Testing for Heterogenous Structures of Advanced Semiconductor Packaging
  • OU: EL – 73
  • Div: 731
  • Group: Infrastructure Materials Group
  • Level of Appointment: Post-doctoral Fellow
  • Schedule of Appointment: full time
  • Total Hours per week: 40
  • Work Location: Physically at NIST (Gaithersburg, MD)
  • Requested Start Date: 2026-07-31
  • End Date: 2027-07-30