Motorola/IEEE Components, Packaging, and Manufacturing Technology Society Graduate Fellowship for Research on Electronic Packaging

The IEE fellowship promotes graduate-level study and research on electronic packaging.

$21,100 per year. Of this sum $9,100 is intended to assist the student with tuition, fees, and books; US$12,000 is to be paid in periodic installments to match the school enrollment terms (usually nine months); complimentary membership in IEEE and CPMT for term of Fellowship.

Must have completed a minimum of four years of college plus one year of graduate study in a recognized scientific or engineering curriculum; must be enrolled full-time in a graduate curriculum leading to a Ph.D., with electronic packaging as a major field of interest.

Student Paper competition conducted during Electronic Components and Technology Conference (ECTC) in May or June. Abstracts must be submitted to ECTC Program committee with request to be considered for Fellowship competition.