Category: Conferences

Two Papers by Yakov Nekrich Accepted by SoCG 2020 Conference

Yakov Nekrich, associate professor, Department of Computer Science, has been notified that two scholarly papers he has authored were accepted by the 36th International Symposium on Computational Geometry (SoCG 2020), which takes place June 23-26, 2020, in Zurich, Switzerland.

Nekrich is a member of the ICC’s Center for Data Sciences.

The two papers are “Further Results on Colored Range Searching,” by Timothy M. Chan, Qizheng He, and Nekrich, and “Four-Dimensional Dominance Range Reporting in Linear Space” by Nekrich alone.

The Annual Symposium on Computational Geometry (SoCG) is an academic conference in computational geometry. Founded in 1985, it was originally sponsored by the SIGACT and SIGGRAPH Special Interest Groups of the Association for Computing Machinery (ACM). It dissociated from the ACM in 2014. Since 2015 the conference proceedings have been published by the Leibniz International Proceedings in Informatics Since 2019 the conference has been organized by the Society for Computational Geometry. (Wikipedia)

Visit the SoCG 2020 website.

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Thomas Oommen Presents Lecture at TRB Annual Meeting

Members of the Michigan Tech Transportation Institute (MTTI) were active at the

Among the many Michigan Tech students and faculty who attended and presented at the 2020 Transportation Research Board (TRB) Annual Meeting held recently in Washington, DC. was Thomas Oommen (GMES), who gave a lecture on “Remote terrain Strength for Mobility Characterization” at the meeting’s lectern Session 1384: Integration of Remote Sensing Techniques and Classical Instrumentation. Oommen is a member of the ICC’s Center for Data Sciences.

The Transportation Research Board (TRB) 99th Annual Meeting was held January 12–16, 2020, in Washington, D.C. More than 13,000 transportation professionals from around the world were expected to attendd.

The meeting program covered all transportation modes, with more than 5,000 presentations in nearly 800 sessions and workshops, addressing topics of interest to policy makers, administrators, practitioners, researchers, and representatives of government, industry, and academic institutions. A number of sessions and workshops focused on the spotlight theme for the 2020 meeting: A Century of Progress: Foundation for the Future.

Learn more about the TRB.

Read the full Tech Today On the Road article.

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Technical Paper by Nathir Rawashdeh Accepted for SAE World Congress

An SAE technical paper, co-authored by Nathir Rawashdeh, assistant professor, CMH Division, College of Computing, has been accepted for publication at the WCX SAE World Congress Experience, April 21-23, 2020, in Detroit, MI.  The title of the paper is “Mobile Robot Localization Evaluations with Visual Odometry in Varying Environments using Festo-Robotino.” 

Abstract: Autonomous ground vehicles can use a variety of techniques to navigate the environment and deduce their motion and location from sensory inputs. Visual Odometry can provide a means for an autonomous vehicle to gain orientation and position information from camera images recording frames as the vehicle moves. This is especially useful when global positioning system (GPS) information is unavailable, or wheel encoder measurements are unreliable. Feature-based visual odometry algorithms extract corner points from image frames, thus detecting patterns of feature point movement over time. From this information, it is possible to estimate the camera, i.e. the vehicle’s motion. Visual odometry has its own set of challenges, such as detecting an insufficient number of points, poor camera setup, and fast passing objects interrupting the scene. This paper investigates the effects of various disturbances on visual odometry. Moreover, it discusses the outcomes of several experiments performed utilizing the Festo-Robotino robotic platform. The experiments are designed to evaluate how changing the system’s setup will affect the overall quality and performance of an autonomous driving system. Environmental effects such as ambient light, shadows, and terrain are also investigated. Finally, possible improvements including varying camera options and programming methods are discussed.

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All Researchers Invited to Research Development Day 2020

by Research Development Office

All Michigan Tech researchers are invited to participate in the 2020 Research Development Day at Michigan Tech. The event will be held Thursday, Jan. 9. The content of the 2020 event is new and designed for both new and returning attendees.

Multiple sessions are planned for faculty at all career stages and from all disciplines. Research staff and post-docs from any discipline are also likely to find sessions of interest. We are excited to welcome Jose Fuentes as our keynote speaker.

Fuentes is an experienced faculty researcher at Penn State, with a significant track record of international work and broad research impact. As in previous years, we will end the day with research recognitions, celebrating accomplishments from across the university over the past year, followed by a networking social.

A condensed agenda is found on the reservation form. Your RSVP is requested by Jan. 3 to finalize meal counts and room arrangements. If your schedule does not permit you to attend the full day, the RSVP allows you to sign up for morning, lunch, and/or afternoon sessions.

The RSVP form should take only a minute or two to complete. A reminder and final agenda will be sent in the new year. Please contact rd-l@mtu.edu with any questions.

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Nathir Rawashdeh to Present Paper at Advances in Mechanical Engineering Conference

Nathir Rawashdeh

A conference paper co-authored by Nathir Rawashdeh (CC/MERET), has been accepted for presentation and publication at the 5th International Conference on Advances in Mechanical Engineering, December 17-19, 2019, in Istanbul, Turkey.

The paper is entitled, “Effect of Camera’s Focal Plane Array Fill Factor on Digital Image Correlation Measurement Accuracy.” Co-authors are Ala L. Hijazi of German Jordanian University, and Christian J. Kähler of Universität der Bundeswehr München.

Abstract: The digital image correlation (DIC) method is one of the most widely used non-invasive full-field methods for deformation and strain measurements. It is currently being used in a very wide variety of applications including mechanical engineering, aerospace engineering, structural engineering, manufacturing engineering, material science, non-destructive testing, biomedical and life sciences. There are many factors that affect the DIC measurement accuracy where that includes; the selection of the correlation algorithm and parameters, the camera, the lens, the type and quality of the speckle pattern, the lightening conditions and surrounding environment. Several studies have addressed the different factors influencing the accuracy of DIC measurements and the sources of error. The camera’s focal plane array (FPA) fill factor is one of the parameters for digital cameras, though it is not widely known and usually not reported in specs sheets. The fill factor of an imaging sensor is defined as the ratio of a pixel’s light sensitive area to its total theoretical area. For some types of imaging sensors, the fill factor can theoretically reach 100%. However, for the types of imaging sensors typically used in most digital cameras used in DIC measurements, such as the “interline” charge coupled device CCD and the complementary metal oxide semiconductor (CMOS) imaging sensors, the fill factor is much less than 100%. It is generally believed that the lower fill factor may reduce the accuracy of photogrammetric measurements. But nevertheless, there are no studies addressing the effect of the imaging sensor’s fill factor on DIC measurement accuracy. We report on research aiming to quantify the effect of fill factor on DIC measurements accuracy in terms of displacement error and strain error. We use rigid-body-translation experiments then numerically modify the recorded images to synthesize three different types of images with 1/4 of the original resolution. Each type of the synthesized images has different value of the fill factor; namely 100%, 50% and 25%. By performing DIC analysis with the same parameters on the three different types of synthesized images, the effect of fill factor on measurement accuracy may be realized. Our results show that the FPA’s fill factor can have a significant effect on the accuracy of DIC measurements. This effect is clearly dependent on the type and characteristics of the speckle pattern. The fill factor has a clear effect on measurement error for low contrast speckle patterns and for high contrast speckle patterns (black dots on white background) with small dot size (3 pixels dot diameter). However, when the dot size is large enough (about 7 pixels dot diameter), the fill factor has very minor effect on measurement error. In addition, the results also show that the effect of the fill factor is also dependent on the magnitude of translation between images. For instance, the increase in measurement error resulting from low fill factor can be more significant for subpixel translations than large translations of several pixels.
Request the full paper here.
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